Hittech Group and Norsk Titanium announced an expansion of their semiconductor partnership. The aim is to increase capacity utilisation and support the growing demand from leading semiconductor equipment OEMs, including advanced lithography applications, driven by the rapid adoption of artificial intelligence, advanced computing, and global digitalisation.
Marco Verloop, COO and Group Director at Hittech Group: “This collaboration with Norsk Titanium enables us to scale efficiently while maintaining the high precision and quality standards required by the semiconductor industry. By reducing process complexity and increasing throughput, as well as strengthening our industrial integration, we are enhancing our ability to support the rapidly increasing growth in the semiconductor market. Together, we have established a robust and scalable production model that offers both performance and cost advantages.”
Fabrizio Ponte, CEO of Norsk Titanium: “AI is accelerating the need for next-generation computing infrastructure, which in turn is driving demand across the semiconductor capital equipment supply chain. By closely integrating our industrial platforms and selectively adding production steps, we are enabling Hittech Group to expand capacity while strengthening our position in the semiconductor value chain. This partnership provides a clear blueprint for how we scale into additional applications and markets”.
On the left in the photo: a 3D-printed titanium aircraft part by Norsk Titanium, machined by Hittech into the final component on the right. When working with 3D-printed preforms, we use only a fraction of the titanium compared to machining from titanium blocks.
